====== Semeconductor 半导体 ======
  * [[https://zh.wikipedia.org/zh-cn/%E5%8D%8A%E5%AF%BC%E4%BD%93|半导体]]
===== the-semiconductor-ecosystem =====
  * [[https://steveblank.com/2022/01/25/the-semiconductor-ecosystem/|the-semiconductor-ecosystem]]
==== 半导体行业组成： ====
  * Chip Intellectual Property (IP) Cores
    * {{ :public:it:chip-ip-cores-2.webp |}}
  * Electronic Design Automation (EDA) Tools
    * 该行业由三个美国供应商主导--Cadence、Mentor（现在是西门子的一部分）和Synopsys
    * 一个使用这些EDA工具的大型工程团队需要**2-3**年的时间来设计一个复杂的逻辑芯片
    * 随着芯片变得越来越复杂，开始插入人工智能辅助工具来自动化加快芯片设计流程。
  * Specialized Materials
    * Silicon wafers(硅晶晶圆) – and to make those they need crystal growing furnaces
    * Over 100 Gases are used – bulk gases (oxygen, nitrogen, carbon dioxide, hydrogen, argon, helium), and other exotic/toxic gases (fluorine, nitrogen trifluoride, arsine, phosphine, boron trifluoride, diborane, silane, and the list goes on…)
    * Fluids ([[wp>photoresists]]光刻胶, top coats涂料, [[https://www.surfaceconditioning.saint-gobain.com/news/choosing-best-cmp-slurry|CMP slurries]])
    * [[wp>Photomasks]]
    * Wafer handling equipment, dicing
    * [[https://www.microwavejournal.com/articles/21140-rf-technology-in-semiconductor-wafer-processing|RF Generators]]
  * Wafer Fab Equipment (WFE)
    * 五家公司主导行业：Applied Materials, KLA, LAM, Tokyo Electron and ASML
    * 是地球上最复杂（也是最昂贵）的机器
  * “Fabless” Chip Companies
  * Integrated Device Manufacturers (IDMs)
    * 新的前沿芯片 (3nm) 流片的平均成本现在为 5 亿美元
  * Chip Foundries
    * They design unique processes using this equipment to make the chips,But they don’t design chips
    * [[https://www.tsmc.com/english|TSMC]] 台积电 is the leader in logic, Samsung 三星 is second
    * Fabs are short for fabrication plants – the factory that makes chips
    * Chips are probably the most complicated products ever manufactured.  The diagram below is a simplified version of the 1000+ steps it takes to make a chip：{{ :public:it:chip-fab-steps-2.webp |}}
  * Outsourced Semiconductor Assembly and Test (OSAT)
==== Fabs issue ====
  * 建造晶圆厂的成本飙升——现在一个芯片工厂的成本超过 100 亿美元。原因之一是制造芯片所需的设备成本飙升
    * 荷兰ASML公司的一台先进光刻机就耗资1.5亿美元
    * There are ~500+ machines in a fab (not all as expensive as ASML)
    * 晶圆厂建筑非常复杂。制造芯片的洁净室只是一组复杂管道的冰山一角，这些管道在正确的时间和温度下将气体、电力、液体全部输送到晶圆厂设备中
  * 保持领先的成本高达数十亿美元，这意味着大多数公司已经退出了。2001年，有17家公司在生产最先进的芯片，今天只有两家：三星和台积电。{{ :public:it:companies-at-leading-edge.webp |}}